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Advanced Materials, Reliability and Failure Analysis

This course will cover wide bandgap (WBG) Semiconductors SiC diodes and pin diodes, SiC-MOSFETS, IGBT, GaN devices: HEMTs and MOSFETs, Process technologies for WBG devices and Application examples: Current Technologies.
Packaging of Power Devices , Reliability test of power devices , Current Collapse, Thermal reliability, Failure mechanisms and Failure analysis: Static Failure, Failure over the lifetime

SemesterSummer
ECTS5
StructureLectures, Assignments
LanguageEnglish
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